The DE400D Thermal Evaporator is assembled with multiple thermal evaporation source, the substrate is mounting on
the top of the chamber and rotary or on the horizontal axial on the side of chamber
Configuration
主要配置
| Evaporation Chamber 蒸發(fā)腔體 | 304 stainless steel chamber with viewport 蒸發(fā)腔體為304不銹鋼，并有觀察窗 |
| Vacuum Pumping 真空泵 | Cryo-pump or Turbo pump and dry rough pump 配備冷凝泵或分子泵和無油機械泵 |
| Vacuum Valve 真空閥門 | Pneumatic HV gate valves 氣動控制高真空插板閥 |
| Evaporation Source 蒸發(fā)源 | Multiple thermal evaporation source 多組熱蒸發(fā)源 |
| Optional Load Lock chamber 樣品室 | 304 stainless steel chamber with viewport 蒸發(fā)腔體為304不銹鋼，并有觀察窗 |
| Sample Stage 樣品臺 | Top mount and rotary or Side mount polar Substrate 頂部安裝旋轉的樣品臺或側面安裝的轉角樣品臺 |
| Film Control 膜厚檢測 | Crystal Film thickness Monitor and Control 晶振膜厚監(jiān)控 |
| Vacuum Gauging 真空測量 | Wide range vacuum gauge and rough gauge 寬量程真空計用于測量真空和粗抽計 |
Specification
主要技術指標
| The Base Vacuum Pressure 極限真空度 | Better than 5E-8 Torr 優(yōu)于5E-8托 |
| Sample Loading Capacity 裝樣能力 | One Max. 8 inch flat substrate or multi small substrate 一個zui大8英寸的平板基片或多個小基片 |
| Max. Evaporation Temperature zui高蒸發(fā)溫度 |
1500oC |
| Rate Resolution 蒸發(fā)速率分辨率 | 0.05 Angstroms/sec |
| Thickness Resolution = 0.02 Angstroms 膜厚分辨率 | 0.02 Angstroms
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Features 特點
D shape Chamber of front open door for easy inside operation D型腔體前開門便于腔體內部操作和維護
Stand along system frameworks and electric rack 獨立的系統(tǒng)機架和電器柜
The deposition process can be accuray controlled by source temperature or film thickness control 薄膜沉積工藝可以通過準確的溫度控制，也可通過膜厚儀準確控制速率
Optional Substrate Cooling or heating 樣品臺可選水冷或加熱
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For R&D Thin Film Deposition
用于薄膜沉積研發(fā)
Ideal tools for LIFT-OFF process
用于LIFT-OFF工藝的理想平臺
Ideal tools for GLAD process with side mount substrate stage
若采用側裝樣品臺可用成為GLAD工藝的理想平臺
Evaporate metal, Semiconductor or Insulation Materials （material depends）
可蒸發(fā)金屬，半導體或介質材料（視具體材料而定）
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